SinkPADTM MCPCB Technology reduces LED junction temperature compare to conventional MCPCB, Aluminum PCB or FR4 PCB.
The SinkPADTM design completely eliminates the substance with the lowest thermal conductivity/highest thermal resistance from the system. SinkPADTM still uses a dielectric, but this dielectric insulates the metal base electrically and leaves it uninsulated thermally. This not only increases thermal conductivity but also directly reduces production costs. In the case of applications that already had inadequate thermal conduction rates and then came to require an active cooling system, the reliance on these active cooling systems can be greatly reduced; reducing the size of these systems or eliminating them altogether will also reduce production costs.
SinkPADTM technology is also possible with multilayer printed wiring substrates without effecting thermal performance. Conventional Metal Back multilayer PCB’s add thermal resistance and likely run into a thermal wall, our DIRECT THEMRAL PATH method can maintain direct heat transfer regardless of the number of PWB layers.